About Polymatech Electronics Limited

Polymatech – Company History & Key Milestones

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Origins

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• 1947 – Fuji Rubber Co., Ltd. begins production in Tokyo and later establishes its headquarters in Ginza.

• 2018 (August) – Fuji Rubber sells Polymatech Electronics Pvt. Ltd. to the Nandam Family through a Share Purchase Agreement.

• 2019 – The Nandam Family modernizes the facility with major building repairs and infrastructure upgrades to support advanced semiconductor manufacturing.

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Growth & Innovations

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• 2020–2023 – Major R&D investments in semiconductor materials, advanced polymers, and optoelectronics.

• 2023 – Launch of high-performance MicroLED and COB LED packaging, establishing Polymatech as an early leader in next-generation semiconductor lighting in India.

• 2024 – Expansion into sapphire components (cubes, spheres) and precision materials for global semiconductor and metrology markets.

• Ongoing – Development of conductive materials, thermal interface compounds, specialty elastomers, and next-gen semiconductor packaging technologies.​

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Acquisitions & Capacity Expansion

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• Nisene Technology Group (USA)
  Acquired to strengthen semiconductor decapsulation, reliability testing, and advanced packaging-tool capabilities.

• Brandner PCB (Estonia)
  Integrated to enhance advanced materials, PCB technologies, and European R&D collaboration.

• 2023 – France Plant
  Established to support European demand for semiconductor materials and high-precision manufacturing.

• Singapore Plant
  Added to expand high-precision semiconductor component production and global supply-chain capability.

• Bahrain Plant
  Set up as a regional manufacturing hub serving Middle Eastern and international markets.

• Raipur Plant (India) – Under Construction
  New facility being developed to scale domestic production of advanced materials and semiconductor components.